ON Semiconductor centralized and decentralized door control module solutions

According to IC Insights, by 2030, the cost of electronic products in the entire vehicle will account for 50%. The continuous development of automotive electronics has greatly improved the handling, safety and comfort of automobiles. However, with the increasing number of automotive electronic devices, the complexity of automotive system design is also increasing. Taking the door control system as an example, the window lift, the door switch, the rear view mirror folding, the horizontal and vertical adjustment, the electric heating, the turn signal, the ground light, the safety light, the control panel backlight, the button, the rear view in the advanced configuration Mirror electric anti-glare, etc., more and more functional requirements, the design is more and more complex. In response to the increasingly complex automotive door control design, ON Semiconductor, the world's leading semiconductor manufacturer, offers a wide range of device selection and system solutions.

Electronic door control is broadly divided into two architectures: centralized control and decentralized control. Centralized control controls and drives each load in the door through the central module, which reduces overall cost, but increases the complexity of the controller, and lacks flexibility, and the cost of product upgrades is large; decentralized control is for each door The internal load is controlled by the respective ECU module, or can be controlled by the driver's side ECU through the CAN/LIN bus. The features are simple structure, better interchangeability and compatibility, and easy upgrade, but the cost is high. ON Semiconductor is able to provide complete solutions for two different architectures to meet the diverse needs of different customers.

Electronic door control design two architectures

Figure 1: Two architectures for electronic door control design

Centralized door control module solution

ON Semiconductor offers a broad portfolio of automotive components for gated solutions: from automotive grade low dropout (LDO) power supplies, door locks, window lifts, mirror adjustment motor drives, light bulbs, relay drives, automotive-grade intelligence FETs, stand-alone LIN transceivers, stand-alone CAN transceivers, FlexRay transceivers, and system-level base chips (SBCs) covered by the in-vehicle network (IVN).

1) LDO products

LDO linear regulators are used in battery and post-regulation with standard/low quiescent current, high power supply rejection ratio (PSRR)/ultra-low quiescent current, and tracker and current sensing. ON Semiconductor offers LDO products that fully support automotive application features, including primary and secondary power. Based on the reference design of ON Semiconductor's automotive LDO, the quiescent current is 8μA~200μA, and the output voltage is 0.7V~10V. It is suitable for low ESR capacitors and the output current is 100mA~3A.

Reference power supply design and simulation model

Figure 2: Reference Power Supply Design and Simulation Model

Depending on the definition of quiescent current Iq between battery charging and load supply, ON Semiconductor has divided LDO products into four grades:

Ÿ Standard Iq LDO: 100μA "Iq

Ÿ Low Iq LDO: 50μA "Iq" 100μA

Ÿ Ultra low Iq LDO: 25μA "Iq "50μA

极 Very low Iq LDO: Iq "25μA

The NCV42xx and NCV85xx are standard quiescent current Iq > 60 μA devices. As a secondary power source, the NCV42xx device is a rugged LDO family that offers a variety of integrated features such as fault protection and thermal overload. The NCV85xx is a family of micropower LDOs that offer adjustable output and fixed outputs of 2.5 V, 3.3 V, 5 V, 8 V, and 10 V in a variety of thermally enhanced packages.

The NCV86xx is pin compatible with standard quiescent current LDOs with very low quiescent current of 33 μA<Iq<50 μA. The NCV87xx has an ultra-low quiescent current of Iq<33 μA, which is compatible with very low quiescent current LDO pins.

2) Motor drive products

The ON Semiconductor NCV7703 integrates three independent half-bridges that can be configured for high-side, low-side and H-bridge through standard SPI communication for automotive DC motor control applications. The NCV7703 has a very low quiescent current in sleep mode of only 1μA; the minimum operating voltage is 5V; the three sets of high and low sides can be connected as half-bridge and H-bridge. Other features include compatibility with 5V and 3.3V systems; 0.5A continuous operating current (peak 1A), Rdson typical value of 0.8?; overvoltage, undervoltage lockout; fault feedback; 1.4A overcurrent threshold detection, selectable shutdown; 3A automatic shutdown limit; over temperature alarm and protection; ESD protection reaches 6kV.

The NCV7707 is a car body control system power driver chip that controls the front door load and controls the rear view mirror functions such as mirror position, heating and folding, including electric anti-glare rearview mirrors. In addition, the door lock and safety lock H-bridge drive and four sets of lamp drivers are integrated. The main features of the NCV7707 include an integrated PWM generator; it can be used for electrical anti-glare rearview mirror control, ambient light adjustment, advanced short-circuit processing, and PWM for motor output. Additional values ​​include PWM high flexibility; ambient light adjustment; fast electrical anti-glare rearview mirror adjustment time; capable of driving high power locks.

The NCV7707 electric anti-glare rearview mirror control scheme is shown in Figure 3. Electric anti-glare is controlled by NCV7707, SPI controls electric anti-glare rearview mirror; integrated 6-bit DAC and brightness control logic; integrated discharge low side; verification diagnostic function.

NCV7707 electric anti-glare rearview mirror control scheme

Figure 3: NCV7707 electric anti-glare rearview mirror control scheme

The NCV7710 is an automotive body control system driver chip that integrates an H-bridge for controlling the door lock motor. The NCV7710 is a simplified version of the NCV7707 with 24-bit SPI control. Key features of the NCV7710 include advanced short-circuit processing; PWM for motor output; and SPI interface for control and diagnostics. The added value is that it can drive high power locks, and the hardware and software are compatible with NCV7707.

3) Bulb / Relay Drive Products

The NCV7608 is a universal integrated driver with 8 sets of outputs that can be used as high or low sides. Each channel can provide 350mA drive current and can drive different types of motors and loads such as bulbs, LEDs and relays. The NCV7240 is an 8-channel low-side driver that provides 600mA drive capability per channel and a 16-bit SPI control for easy fault reporting including open, short, overload and over temperature. In addition, the output can be controlled in parallel via the INx pin. A dedicated limp-home mode pin (LHI) enables OUT1-OUT4 and turns off OUT5-OUT8.

SmartFETs are used for high/low side drive of external loads. The automotive grade high/low side smart FET devices from ON Semiconductor include NCV8401A, NCV8402A, NCV8402AD, NCV8403A, NCV8405A, NCV8406A, NCV8408, NCV8440A and other low side drivers, as well as NCV8450A. High-side drivers such as NCV8452, NCV8460A, and NCV8461. These devices are equipped with protection MOSFETs and add a variety of protection features.

4) Communication circuit products

The NCV7340-3 high-speed, low-power CAN transceiver relies on the ISO11898-2 standard to connect the CAN controller to the CAN high-speed bus. The chip is ideal for larger networks, using the Vsplit function to stabilize the bus and to enter a low-power mode to reduce total power consumption. Its main features include system-level ESD protection with a withstand voltage of ±12kV; the same functionality and performance as the AMIS42665; improved EMI performance.

The NCV7425 is a System Basis Chip (SBC) that integrates a LIN v2.1 transceiver and LDO to meet high performance, reliability and low cost requirements. It offers 3.3V and 5V output options and supports 150mA load. The added value is that the system reliability is increased compared to the separation device, and the BOM is reduced to reduce the cost.

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