In the off-season, the semiconductor boom will continue until next year.


The world's major electronic index showed a correction in late April and early May: the Philadelphia Semiconductor Index in the United States after the continuous victory of the Dow Jones index, the callback is greater than the Dow Jones index; China's Taiwan semiconductor index first suppressed, the performance is stronger than the Taiwan weighted index; mainland CSRC electronics industry The index performed better than the Shanghai and Shenzhen 300 Index in April, but the rate of correction in early May was greater than that of the Shanghai and Shenzhen 300 Index.

Industry data remained strong: global semiconductor market sales in March was 23 billion US dollars, up 58.6% year-on-year and 4.8% quarter-on-quarter; US and Asia-Pacific market growth has peaked, but Europe and Japan market grew strongly; North American semiconductor equipment The order-to-bill ratio remained at a high of 1:1.19. Although the order-to-bill ratio of semiconductor equipment remains high, we emphasize that there is still a big gap from the absolute peak. The current monthly order volume is still higher than the US$1.64 billion in May 2007 and US$1.78 billion in June 2006. The larger gap, and the industry procurement mainly invested in advanced process equipment, the release of advanced process capacity will take 1-2 years, the total industry capacity has not increased significantly. Therefore, we believe that it is too early to worry about oversupply in the semiconductor market. This round of industry boom should last at least until 2011. In addition, the spot prices of DRAM and Flash are basically stable; Taiwan's semiconductor manufacturers' performance in April was brilliant, and the OEM's production capacity was tight, which affected the performance of packaging and testing and IC design manufacturers.
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Property market regulation and re-education sharps real estate stocks rebounded or has started a small amount of funds to reinforce A-share market Xinjiang resource tax reform June 1 implementation of beneficiary shares Sino-US renewable energy forum 53 shares now opportunities fiber access investment exceeded expectations (beneficiary shares) Electronics Information stocks make up the decline and reflect the trend of funds, the daily limit, the death squad, the fire line, and the 14 strong stocks, 36 stocks, the stock market, and the 5 major industries [shares]. The rebound will be seen on Friday, the first quarter is not weak. Taiwanese semiconductor makers performed strongly in April. From the point of view of orders, the demand for graphics chips and communication chips is still strong, and consumer electronics chips are entering the peak season. The visibility of OEM orders has reached the third quarter, and the packaging and testing plant has sufficient confidence in the growth of the second quarter revenue. The capacity gap of TSMC's advanced process orders is 30%-40%. From the perspective of capacity, semiconductor manufacturers are actively expanding production capacity, but mainly based on advanced processes, some of the used equipment is being transferred to the mainland and other regions. Judging from the order-to-bill ratio of semiconductor equipment and the amount of equipment shipped, we believe that the current capacity expansion is in a reasonable range and will not be oversupplied in the next two years (unless demand is sharply reduced). In short, we judge that the global semiconductor market has entered a rising channel and will continue to maintain the “recommended” investment rating of the semiconductor industry by 2011. It is strongly recommended that Silan Micro (600460, stocks), recommend Huatian Technology (002185, shares it), Tongfu Microelectronics (002156, shares it), Changjiang Electronics Technology (600584, shares it).

Silan Micro: One of the A-share IC design companies, but unlike pure IC design companies, Silan Micro also owns IC manufacturing and LED chip manufacturing. The company will focus on a 6-inch high-pressure special process, taking a combination of special process manufacturing and design. At present, the company is the largest LED outdoor color screen chip supplier in China, and the company's future expansion in the LED field deserves special attention.

Huatian Technology: It is one of the leading companies in the domestic IC packaging and testing industry. The customers are mainly domestic semiconductor companies, and the sound financial management and excellent cost control capabilities constitute the company's competitive advantage (310368, fund bar). The company is actively preparing to expand production, and is also increasing investment in research and development, trying to break through the technical bottleneck and have great potential in the future.

Changdian Technology: one of the leading IC packaging testers in China, with the largest domestic packaging and testing capability and leading packaging and testing technology, the company's highlight is SiP (system-in-package) technology. We believe that the company has passed the most difficult year. As the company's transformation success and the proportion of SiP products continue to expand, the company's performance will grow rapidly.

Tongfu Micro-Electricity: It is one of the leading companies in the domestic IC packaging and testing industry. The packaging and testing business ranks first in China. The company has high-quality customer resources and strong technical strength, and its development is relatively stable. The cooperation with Toshiba will have an important impact on the company's future development.
(Industrial Securities R&D Center)

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