Fujipoly's latest thermal interface material Fujipoly San-ETM is now available for sale. This thermal pad not only inherits Fujipoly's consistent high quality standards, but also has the advantages of low hardness and low cost. With a thermal conductivity of 1.6W/mK, the product is soft and suitable for any solid surface, providing an effective heat dissipation path for heat transfer. With its low thermal resistance, it will be an excellent thermal interface material for microchips and heat sinks (such as metal heat sinks or chassis) to ensure that the cores operate at low temperatures. It is not only soft in material, but also has good workability and is easy to attach to the surface of the micro core. This article refers to the address: http:// Guangzhou Etmy Technology Co., Ltd. , https://www.gzdigitaltalkie.com
Fujipoly San-ETM Thermal Pad