Silan Micro issued a bond of not more than 600 million yuan today

[High-tech LED News] Hangzhou Silan Microelectronics Co., Ltd. (hereinafter referred to as "issuer", "company" or "Slan Micro") issued no more than 600 million yuan of corporate bonds (hereinafter referred to as "current bonds") Obtained the approval of the China Securities Regulatory Commission (CSRC) [2011] No. 835.

Silan Micro issued 600 million yuan of corporate bonds in the current period, each with a face value of RMB 100, totaling 6 million, and the issue price is RMB 100 per piece.

The corporate bonds issued this time are intended to repay borrowings, adjust the debt structure and supplement the company's liquidity. The general meeting of shareholders is requested to authorize the board of directors to decide the amount and proportion of funds raised to repay the borrowings and replenish the working capital according to the actual situation of the company's financial situation.

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