The process design of the LED includes the design of the chip and the packaging of the chip. At present, the packaging technology of high-power LED and its heat dissipation technology are hotspots in today's society. Since the high-power LED packaging process is relatively simple process to speak, but the actual process is very complicated. Moreover, LED packaging technology directly affects the service life of LEDs. Therefore, in the process of high-power LED packaging, many factors must be considered, such as light, heat, electricity, machinery and many other factors. Optical aspects should consider the high-power LED light decay problem, thermal considerations should consider the heat dissipation of high-power LEDs, electrical considerations should consider the design of high-power LED drive power, mechanical aspects should consider the packaging form of LED in the packaging process Wait. 1 high power LED package requirements and key technologies High-power LEDs have the advantages of long life, low pollution, low power consumption, energy saving and impact resistance. Compared with traditional lighting fixtures, high-power LEDs not only have good monochromaticity, high optical efficiency, strong light efficiency, but also can meet different needs of high color rendering index. Despite this, the packaging process of high-power LEDs has strict requirements. Specifically embodied in: 1 low cost; 2 system efficiency maximization; 3 easy replacement and maintenance; more than 4 LEDs can be modularized; 5 low heat dissipation coefficient and other simple requirements. According to various factors to be considered in high-power LED packaging technology , several points have been proposed in the key technologies of packaging. mainly include: (1) In terms of high-power LED heat dissipation : Consider a low thermal resistance package. The LED chip is a solid-state semiconductor device that is the core of the LED light source. Since the high-power LED chips are of different sizes, the driving method uses a constant current driving method. The electric energy can be directly converted into light energy. Therefore, the LED chip needs to absorb most of the input electric energy during the lighting process, and a large amount of heat is generated in the process. Therefore, the heat dissipation technology for high-power LED chips is an important technology for LED packaging technology, and also a key problem that must be solved in the process of high-power LED packaging. (2) The heart of the LED is a semiconductor wafer. One end of the chip is attached to a bracket, one end is a negative pole, and the other end is connected to the positive pole of the power source. Therefore, the high light extraction package structure is also an important key technology in the high power LED packaging process. In the process of illuminating the LED chip, during the emission process, due to the difference in refractive index at the interface, the loss of photon reflection and the total loss of reflection may be caused. Therefore, a relatively high refractive index transparent layer may be coated on the surface of the chip. glue. This layer of transparent plastic must have high light transmittance, high refractive index, good fluidity, easy spraying, and good thermal stability. Currently commonly used transparent adhesive layers are epoxy resin and silica gel. 2LED package form With the development of science and technology, LEDs are available in a variety of package formats, including leaded packages, surface mount chip packages, on-chip chip direct packages, and system package packages. Constant Voltage Transformer,Laminated Transformer,Encapsulated Transformer,12V Ac Transformer IHUA INDUSTRIES CO.,LTD. , https://www.ihua-inductor.com