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2009 is a year in which the internal and external environment of China's semiconductor lighting industry has changed. From the perspective of industrial environment, the major events affecting the industrial environment at home and abroad continue, semiconductor lighting and the world's social and economic development are more closely linked, opportunities and challenges coexist; from the perspective of the industry itself, domestic and foreign technology continues to break through, new applications With rapid development, relevant supporting policies have been gradually introduced, and industrial competition has seen new forms in technology, market and products. From the perspective of industrial development trends, the development opportunities of China's semiconductor lighting industry are obviously greater than challenges, and the overall industrial environment and industrial competition are further. Perfect, the prospects for industrial development are more clear.
2009 is also a year of great fluctuations in the development of China's semiconductor lighting industry. In the first quarter, due to the continued impact of the 2008 financial crisis leading to a decline in exports, industrial development was slow, and some enterprises had difficulties in operating or even closed down. Beginning in the second quarter, with the advancement of China's “Ten Cities and Ten Thousand Cities†application demonstration project and the improvement of the domestic and international market situation, the semiconductor lighting industry began to stabilize and rebound, becoming one of the first industries to get rid of the impact of the financial crisis. In the second half of the year, the situation of China's semiconductor lighting industry continued to improve. Under the impetus of energy saving and emission reduction and low carbon economy, semiconductor lighting began to become a hot industry.
In 2009, due to the rapid increase in demand for chips, the production capacity of epitaxial chips in China increased rapidly. According to statistics, there are more than 40 companies engaged in LED chip production in China. The company has more than 150 MOCVDs, of which more than 135 production GaN MOCVDs have been installed, and about 18 production MOCVDs, domestic research institutes. Research equipment has also increased. The epitaxial chip investment plans of various enterprises have been further accelerated. According to preliminary statistics, the planned equipment is around 100 units, and its development greatly exceeds the forecast in early 2009.
In 2009, China's chip output value increased by 25% to 2.3 billion yuan, which is basically the same as the 26% growth rate in 2008. In 2009, the production capacity of domestic GaN chips increased significantly, up 60% from 2008, reaching 2.24 billion/month, while the actual annual output increased by 40% to 18.2 billion, and the national productivity also increased to 46%. The performance of domestic chips has been greatly improved, and high-end applications such as display screens, signal lights, outdoor lighting, and small and medium-sized backlights have been recognized. The performance and output of high-power chips have also been greatly improved. In 2009, with the gradual weakening of the financial crisis and the rapid improvement of business operations, domestic chip companies gained a good operating environment in 2009. It is expected that domestic chip production capacity and business operation will remain in the next few years. A quick upgrade process.
In 2009, the output value of China's LED packaging reached 20.4 billion yuan, up 10% from 18.5 billion yuan in 2008; the output increased by 10% from 9 billion in 2008 to 105.6 billion, of which the output value of high-brightness LED reached 18.6 billion yuan. , accounting for 90% of total LED sales. At the same time, from the point of view of product and enterprise structure, there is also a big improvement in China, and SMD and high-power LED packaging are growing rapidly.
In 2009, China's semiconductor lighting applications achieved rapid growth after getting rid of the impact of the financial crisis, with an overall growth of more than 30% and an output value of 60 billion yuan. LED full-color display, solar LED, landscape lighting, consumer electronic backlight, signal, indication, etc. as the main application areas, the growth is relatively stable. In the context of LED-TV acceleration applications, China's LED large-size backlight applications have made important progress, and major TV brands have launched LED-backlit TVs as a key development and promotion product in the next few years. Driven by China's “Ten Cities and Ten Thousands†application demonstration project, indoor lighting applications such as LED street lights and LED spotlights have developed rapidly. LCD backlighting and lighting have grown significantly in 2009 and are gradually becoming the main application areas of semiconductor lighting in China. The composition of semiconductor lighting applications in 2009 is shown in the table below.
In terms of investment, domestic large enterprises and large capitals have begun to vigorously intervene in the semiconductor lighting industry, and industrial investment has increased significantly. According to public statistics, in 2009, the total investment amount of LED projects (including planned investment) across the country has exceeded 20 billion yuan. Many listed companies have entered the field of semiconductor lighting through acquisition or fundraising, and many semiconductor lighting companies are actively preparing for listing. To increase the scale by raising funds.
In terms of technology, domestic small-capacity chips have reached 120lm/W and power chips are 80-100lm/W, which is closer to the level of international industrialization. China's independent intellectual property rights of Si substrate chip light efficiency of 70lm / W, and achieve large-scale production. China's high-power packaging level is basically in line with the international first-class level. The production capacity of small varieties and multi-batch is at the international advanced level, such as LED lamps for special needs such as miner's lamp and landscape lamp.
It is expected that in 2010, there will be some new changes in application promotion, technical level improvement, capital operation and business operation.
In terms of applications, growth will be mainly reflected in lighting and LCD backlight applications, and development in other areas will be relatively stable. With the rapid decline in the price of semiconductor lighting products and the maturity of application technology, the promotion of semiconductor lighting at home and abroad in the fields of municipal, household, commercial, industrial and other professional fields will accelerate, and China has a product manufacturing side. The obvious advantages are expected to become the manufacturing center of LED lighting products, and the manufacturing mode will be reflected in various forms such as OEM, ODM and independent brand production and marketing; although China's LED backlight module industry is still relatively backward, LCD panel industry It is gradually shifting to China. China is likely to become the world's largest LCD TV production base. It will be synchronized with the production of LCD TVs. The production of post-process components such as LED backlight modules will also be concentrated in China. huge.
In terms of technology, the patent restrictions of GaN-based chips and white light technology in China's sapphire substrates still exist. With the improvement of production capacity and technology level of Chinese enterprises and the acceleration of domestic manufacturers' production layout, domestic enterprises will be more directly related to international manufacturers. competition. This also means that international manufacturers will inevitably use patents to consolidate their competitive advantages. Domestic related companies should plan ahead and lay out in advance in patent competition. In 2010 and beyond, the patent authorization of large foreign companies in China will be gradually liberalized. It is expected that in the initial stage, the application of product links will be based on patent licensing transactions to obtain economic benefits, and in the chip and device segments, more patent litigation will be cracked down. Competitors and competitive advantage.
On the enterprise side, companies with advantages in research and development, capital, market, manufacturing, etc. are expected to rapidly expand the scale of related industries, and the concentration of industries will be improved. Inspired by the results of the operation of semiconductor lighting capital in 2009, more companies will plan to go public or introduce strategic investors. The competition of enterprises will shift from product technology to capital and market. This will also lead to the industrial structure. Related adjustments. From the perspective of the industry as a whole, this adjustment will help domestic companies to enter the more complex areas of backlighting, automobiles, lighting and other advantages and gain advantages. In the enterprise competition, the relevant measures of the government will also be a very key factor. It is expected that the focus of the governments at all levels in 2009 will shift from the macro guidance in 2009 to the practical measures that focus more on project implementation. 
China's LED lighting (semiconductor lighting) market development in 2009
In 2009, the output value of China's chips increased by 25% compared with 2008, reaching 2.3 billion yuan; the output value of LED packaging was 20.4 billion yuan; after the impact of the financial crisis, the application of semiconductor lighting increased by more than 30% to reach 60 billion yuan. In 2009, the total scale of China's LED industry totaled 82.7 billion yuan!