Compact and flexible system integrates i.MX processor, Wi-Fi connection and security to help IoT products get to market quickly Semiconductors NV has launched a new "Internet of Things chip" that has greatly advanced the development of edge computing with broad prospects. This scalable product line integrates NXP's ARM-based i.MX application processor, Wi-Fi and Bluetooth into a smaller footprint, giving IoT devices rich functionality, security and connectivity. The new chip helps solve design challenges in applications that are extremely limited in IoT devices. As a system-level miniaturization solution, the IoT Chip provides the performance, scalability, and small size required to enable developers to get their designs to market quickly. Martyn Humphries, vice president of i.MX Application Processors at NXP's Industrial and Consumer Markets, said: "As an important step in the evolution of the vision of the IoT chip from the on-board product to the future, our highly integrated solution completely unveiled the Internet of Things. The mystery of NXP's forward-looking design approach will provide customers with greater cross-system efficiency, enabling them to speed time-to-market without adding additional costs." NXP joins a trusted market leader to deliver future-proof, flexible solutions "IoT Chip" combines NXP's i.MX application processor family with Wi-Fi/Bluetooth solutions to provide developers with proven solutions for the industrial and consumer markets, enabling rapid construction of compact IoT products. Main features of the product: • High performance computing and connectivity − Arm Cortex-A7 application processor delivers high performance and efficiency − High bandwidth dual band 802.11ac Wi-Fi and Bluetooth 4.2 − A similar solution to the Wi-Fi authentication module, using a proven Wi-Fi/BT software stack • Safety − i.MX application processor provides advanced security features such as secure boot, tamper detection and response, and high throughput encryption − To provide additional physical security protection, the “Internet of Things chip†can be extended by a customized inter-chip interface. Integrate a Security Element without increasing the size of the chip package. • Tightly integrated small size structure − The solution with built-in application processor and Wi-Fi/BT is only 14mm x 14mm x 2.7mm − New package design allows hardware designers to stack DDR memories through straight-through boards, simplifying PCB design and saving space • Scalable and modular − Through the inter-chip interface, users can obtain different levels of i.MX performance in the same 14x14 package according to specific needs. − Dimensional compatible modules also offer a range of different Wi-Fi/BT options to meet application needs Listing status NXP's first "IoT chip" based on the i.MX 6ULL ​​application processor will be available in the second half of 2018. The i.MX 7 and i.MX 8 processor configurations will be available in 2019. Power Station 600W,Outdoor Mobile Power Station,Portable Power Bank,Mobile Power Bank Guangdong pisen electronics co., ltd , https://www.pisenpro.com