Alkaline copper plating process using cyanide as a ligand (complexing agent) has been the mainstream of a variety of plating primer plating and pre-plating process. Due to environmental protection and operational safety considerations, the use of cyanide has been severely restricted. Therefore, the development of a cyanide copper plating process has been an important issue for the electroplating industry. To date, no new process has been developed that can completely replace the cyanide copper plating process, but when certain conditions are met, there are also some copper plating processes that can replace cyanide copper plating, such as pyrophosphate copper plating, HEDP copper plating, Pre-impregnated strong adsorption-blocking actives such as copper acrylothiourea copper plating. The improved process of the latter two has made great progress with other early stages of development, especially the HEDP copper plating process. After the use of an auxiliary ligand and the development of new additives, the copper plating layer and the steel substrate are combined. The intensity has been greatly improved. The determination of the cathodic polarization curve and the constant current potential-time curve using an electrochemical workstation, the application of the bend-breaking method for the critical initial current density (ie, the minimum initial current for ensuring the bond strength of the plating) and the quantitative determination of the bond strength of the coating The results show that the addition of an auxiliary complexing agent has benefited from the cathodic polarization of copper during precipitation and reduced the critical initial current density. When the initial plating is performed with a current density of 1 ASD, the surface of the iron can be made before copper deposition. More fully activated, the bonding strength between the copper plating layer and the iron matrix is ​​increased to 6416.38 N/cm2, which is close to the level of copper electroplating on the copper. EXPLOSION WELDING IN FABRICATION PROCESS
10.Packaging and leaving the factory;
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Clad Plates; Electrical Transition Joints; Conducting Materials for New Energy; Structural Transition Joints; Cryogenic Transition Joints; Clad Pipes. Changshu Herun Import & Export Co.,Ltd , https://www.herunchina.com
1. Preparation of the metal materials of the cover plate and the base plate (including surface purification treatment);
2. Explosives, cartridges, interstitial objects and protective layer preparation;
3.Process installation on sandy soil foundation;
4.Explosive welding using electric detonator detonation method;
5.Inspection of the surface and appearance quality of the composite board;
6.Non-destructive testing NDT (UT, PT);
7.Destructive organization and performance inspection to determine the quality of the combination;
8. Processing and shaping such as leveling, shearing or turning (heat treatment as required);
9.Factory inspection: inspection of appearance, surface and size, marking and coding;